All 128 components
Everything in the guide, grouped by where you find it. Each entry carries measured metal yields, current selling prices, the single best identification tell, safe removal temperatures and any hazards.
Processors 8Connectors & pins 8Capacitors 7ICs & chips 13Boards 18Drives & media 6Contacts & relays 20RF, power & vintage 7Automotive 13Other 28
Processors category page →
Ceramic CPU — gold lid + gold pins
Au 2.0–3.5 g/lbAg 0.5–2 g/lbBase Kovar
S
Pentium Pro
Au 0.25–0.45 g eachAg trace
S
Ceramic CPU — no gold lid (black top)
Au 1.0–1.8 g/lbAg 0.3–1 g/lb
A
AMD ceramic with aluminium top (K6)
Au 0.7–1.2 g/lbBase Al plate
B
IBM Multi-Chip / Thermal Conduction Modules
Au 1–5 g per module ≈ 0.3–0.7 g/lbCu ~48 g/lbBase Mo internal wiring
B
Plastic CPU with gold pins (P4, Athlon, S370/462/478)
Au 0.5–1.0 g/lbAg trace–0.3 g/lbCu IHS on P4
B
Slot 1 / Slot A cartridge CPU
Au 0.3–0.75 g/lb wholeAg trace–0.5 g/lb
B
Modern lidded CPU (LGA775+, Core i, Ryzen)
Au 0.10–0.30 g/lbCu 15–25 g per chip
C
Connectors & pins category page →
Gold fingers (trimmed)
Au 2.0–3.0 g/lbBase Cu
S
Gold-fingered RAM
Au 0.3–0.6 g/lbAg 0.5–2 g/lbPd 0.01–0.05 g/lb
A
Gold-plated connectors
Au 0.3–1.0 g/lb wholeBase brass
A
Gold-plated pins
Au 0.7–1.5 g/lb mixedBase brass
A
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Silver-Plated Copper Wire & Coax
Ag 2.8–6.8 g/lb as-received; 5.7–11.3 g/lb stripped conductorCu ~230 g/lbBase 40–55% PTFE/FEP
B
CPU socket (ZIF PGA / LGA)
Au 0.10–0.30 g/lb wholeBase phosphor bronze
C
Ribbon cable & IDC connectors
Au 0.3–0.8 g/lb (heads only)Cu 15–25% in the cable
D
Capacitors category page →
MLCC — palladium-bearing (PME, pre-2000)
Pd 2.3–9 g/lbAg 4.5–23 g/lbBase Ni
S
Tantalum capacitors
Ta 30–40 wt% of the capAg 1–3% in some
B
Ceramic disc capacitors
Ag 4–10 g/lbPd 0.05–0.3 g/lb
C
MLCC — modern nickel (BME, post-2005)
Pd 0.2–0.7 g/lbAg 1.4–2.7 g/lbBase Ni 5–20%
C
Silver mica capacitors
Ag 10–20 g/lbCu ~60 g/lb
C
Aluminium electrolytic capacitors
Base aluminium can
D
Film capacitors (polyester / polypropylene)
Cu ~20 g/lb
D
ICs & chips category page →
Ceramic IC — gold lid + gold legs
Au 3–8 g/lb wholeAg 0.5–3 g/lbBase Kovar
S
Gold flat packs (military / aerospace)
Au 3–10 g/lbAg 1–4 g/lb
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
BGA with gold tab / gold-corner BGA
Au 1.0–2.0 g/lbAg 0.3–1 g/lb
A
Ceramic BGA / CCGA
Au 1–3 g/lbAg 0.5–2 g/lbBase alumina
A
Ceramic CCD/CIS Image Sensors
Au 0.02–0.15 g per ceramic package ≈ 1.8 g/lbAu under 0.001 g per mobile/webcam moduleBase Nd-Fe-B in VCM actuators
A
Ceramic IC — gold legs OR gold lid (not both)
Au 1.0–2.5 g/lbAg 0.5–2 g/lb
A
Gold-plated SMD (SAW filters, RF modules, shields)
Au 0.5–1.5 g/lbAg 0.2–1 g/lb
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
Backup batteries & Dallas RTC modules ☠
Cu ~40 g/lbAu <0.1 g/lb
C
Crystal oscillators & OCXO modules
Au 0.1–0.5 g/lb (modules)Ag 0.5–3 g/lb
C
Thick-film resistor networks (SIP/DIP)
Ag 2–5 g/lbPd 0.2–0.7 g/lb
C
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Boards category page →
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Telecom backplanes
Au 1–3 g/lb wholeAg 0.5–2 g/lbCu 20–30%
A
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Wire-wrap / pin boards
Au 0.6–1.5 g/lbAg 0.5–2 g/lbCu 20–30%
B
Arcade PCBs / JAMMA Boards
Au 0.05–0.20 g per board ≈ 0.09 g/lbCu ~45 g/lbAu ceramic gold-lid customs (FD1094
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
Enterprise Switches, Line Cards & Optics
Au 0.15–0.6 g per large line card ≈ 0.075 g/lbCu ~70 g/lbBase chassis backplane
C
Gold-fingered cards (untrimmed)
Au 0.2–0.5 g/lbAg 0.5–2 g/lbCu 15–25%
C
Graphics cards ⚠
Au 0.20–0.50 g/lbAg 0.5–2 g/lbCu 15–25%
C
Industrial Control Boards (PLC/DCS/SCADA)
Au 0.05–0.20 g/lb typical I/O; 0.25–0.60 g/lb CPU and backplanes; 0.6–1.5 g/lb 1970s–80s ceramic-DIP DCSAg 1–8 g per relay moduleCu ~113 g/lb
C
Peripheral & network cards
Au 0.20–0.50 g/lbAg 0.5–1.5 g/lbCu 15–25%
C
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
Laser Printer Boards, Fusers & Toner Chips
Au 0.01–0.04 g per formatter board ≈ 0.045 g/lbAu 0.0005–0.002 g per toner CRUM chip ≈ 0.3–0.8 g/lb of chipsBase Fuser: no precious metal whatsoever
D
Low-grade boards (PSU, TV, modem, appliance)
Au 0.005–0.05 g/lbAg 0.2–0.8 g/lbCu 8–15%
D
Set-top / cable boxes
Au 0.03–0.10 g/lbAg 0.3–1 g/lbCu 10–15%
D
Vintage Home Computers & Boards
Au 0.05–0.20 g per C64 board; 0.1–0.4 g per Apple II boardAu gold-lid ceramic DIPs at $150–400/lbCu ~40 g/lb
D
Drives & media category page →
Hard drive PCBs
Au 0.3–0.8 g/lbAg 0.5–2 g/lbCu 15–25%
B
HDD head arms & actuator assemblies
Au 0.1–0.3 g/lbNd NdFeB magnetsCu voice coil
C
Hard drive platters
Pt 1–2.2 mg per 3.5" platterBase 10–16 g aluminium each
D
Optical Drives & Laser Pickups
Au 0.01–0.03 g per drive ≈ 0.011 g/lbCu ~16 g/lbBase Al 200–400 g
D
Tape Drives & Libraries (LTO/DLT/DAT)
Au 0.05–0.20 g per LTO drive ≈ 0.03 g/lbCu ~10 g/lbBase 0.7–1.8 kg aluminium per full-height drive
D
Whole hard drives
Au 0.05–0.15 g/lbNd magnetsBase aluminium casting
D
Contacts & relays category page →
Pogo Pins & Spring-Loaded Test Probes
Au 1.4–3.0 g/lbCu ~330 g/lbBase steel springs
S
Silver contacts (switches, breakers, contactors)
Ag 180–400 g/lb of clean cut contacts
S
Silver-Graphite Brushes & Slip Rings
Ag 40–95% by weightCu pigtail + commutator segmentsBase electrographite
S
Aerospace Connectors & Backshells
Au 0.3–0.8 g/lb complete; ~3.6 g/lb de-populated contactsCu ~80 g/lbBase Backshells: ~0 g Au/lb
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Mil Circular Connectors (D38999/MS)
Au 0.20–0.50 g/lb whole; 2.5–4.0 g/lb de-pinned contactsCu ~80 g/lbBase 70–85% Al 6061-T6 shell
A
Card sockets — PCMCIA, CF, SD, SIM
Au 0.8–2.5 g/lbCu ~150 g/lb
B
Machined-pin DIP sockets (gold barrel)
Au 1.0–2.4 g/lbCu ~250 g/lb
B
Relays
Ag 2–20 g/lb of whole relayAu trace
B
Thermostats, Snap Discs & Limit Switches
Ag 0.4–1.6 g/lb as whole discs; 408–431 g/lb as harvested contactsBase bimetal steel discBase Hg ~3–4 g per bulb thermostat ampoule
B
Beryllium copper contacts ☣
Au 0.5–1.5 g/lb when platedCu ~98%
C
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
DIP, Rotary & BCD Switches
Au 0.20–0.40 g/lb (DIP); 0.10–0.25 g/lb (rotary)Ag 1.0–2.5 g/lbBase 60–75% plastic/phenolic
C
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
Reed Switches & Reed Relays
Base Ru ~50–80 µg per switchBase Rh ~0.2–0.5 mg per switchCu ~40 g/lb
D
RJ45 Jacks with Integrated Magnetics
Au 0.02–0.07 g/lbCu ~57 g/lbBase ferrite
D
Tactile switches and metal dome contacts
Au 0.05–0.4 g/lbAg 1–3 g/lbCu ~60 g/lb
D
Terminal blocks and screw terminals
Cu 110–200 g/lb
D
Trimmer Potentiometers (Cermet)
Au <0.15 g/lbBase Ru ~0.05–0.20 mg per unitPd <0.5 mg per unit
D
USB, HDMI, DisplayPort, RJ45 & audio jacks
Au 0.1–0.5 g/lbCu ~80 g/lb
D
RF, power & vintage category page →
RF power transistors ☣
Au 0.5–2 g/lbBase Kovar
A
Gold-plated hermetic transistors (TO-3/TO-5/TO-18)
Au 0.5–2 g/lbBase Kovar
B
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Vacuum tubes
Au 0.1–0.5 g/lb (gold-pin types)Ag traceBase nickel plates
C
Chip antennas (LTCC ceramic)
Ag 6–18 g/lb
D
CRT flyback transformers & deflection yokes ☠
Cu 150–400 g per yokeBase ferrite core
D
Magnetron ☣☣
Ag 0.5–2 g per magnetronCu 200–400 g per unitBase ferrite magnets
D
Automotive category page →
ABS, transmission & body control modules
Au 0.010–0.030 g per moduleAg 0.2–1.5 g in BCM relay contactsCu 40–120 g in the ABS pump motorBase 1.5–3 lb aluminium hydraulic block
C
Airbag control module (ACM/SDM/RCM)
Au 0.010–0.030 g per unitAg 0.05–0.2 g per unit
C
Automotive relays & fuse boxes
Ag 25–80 mg per mini ISO relayCu 1–3 g coil + terminals per relay
C
Automotive wiring harness
Cu 48–52% recovery stripped; ~35% as-pulledAu under 0.1 g per whole vehicle
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
EV / hybrid battery management boards
Au 0.01–0.05 g per master boardAg ~0.1 g per master boardCu 10–50 g busbar traces per cell-tap board
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
Xenon HID ballasts & LED drivers
Au 0.003–0.015 g per ballastCu 30–90 g in the HV transformer and inductorsAg trace in thick-film and solder
C
Airbag inflators & undeployed modules ☠
Base none worth recovering
D
MAF, MAP, knock, crank & cam sensors
Pt 0.5–2 mg per hot-wire MAFAu 0.003–0.010 g per MAF boardAg 10–40 mg thick-film paste on MAP hybridsNd magnets in Hall-type crank/cam sensors
D
Oxygen / lambda sensors
Pt 13 mg per sensor (≈0.05 g/lb)Cu 8–20 g in the leadBase steel body
D
Spark plugs
Pt 1–8 mg per plugBase iridium 0.6–3 mg on Ir plugs
D
Other category page →
Laboratory Platinum Ware
Pt ~454 g/lb — it is solid metalAu 5% in Pt-5%Au XRF fusion cruciblesBase Rh 5–10% in Pt-Rh crucibles
S
Noble Thermocouple Wire (Type R/S/B)
Pt ~410 g per lb of bare noble wireBase Rh 6–30% of one legBase Type K/J/T/E/N: zero PGM
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Silver-Oxide Button Cells
Ag ~30–35% by weight ≈ 150 g/lbBase Zn anode ~25%Base LR/AG alkaline
S
Sterling & Silver-Plated Flatware
Ag 92.5% ≈ 420 g/lb sterlingAg hollow-handle knives: only 8–20 g per pieceAg silver plate: ~0.1–0.5 g per teaspoon
S
Fiber transceivers (SFP/GBIC/QSFP) ⚠
Au 0.5–1.5 g/lb (whole modules)Ag trace
A
X-Ray Film & Spent Fixer
Ag 0.07–0.10 ozt/lb (2.2–3.1 g/lb) medical filmAg 0.15–0.25 ozt/lb industrial NDT filmAg 1–6 g/L in spent fixer
B
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Insulated copper wire
Cu 45–78% recovery by grade
C
Metal oxide varistors (MOVs)
Ag 6–14 g/lb
C
Semiconductor Wafers & Fab Tooling
Au 0.0045 g/lb generic research-fab wafer scrapAu 7.4 g/lb for 1 µm gold-backed wafersBase quartz and SiC boats: zero metal
C
SIM & smart chip cards
Au 1.4–3.6 g/lb of punched modules
C
Solar cells & panels
Ag 3–8 g/lb of bare cellsBase 2–3 kg aluminium frame
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Carbon and metal film resistors
Cu ~15 g/lb
D
Ceramic HRC fuses (and glass fuses)
Ag 1–3 g/lbCu ~90 g/lb
D
Clip-on and bolt-on board heatsinks
Cu 0–450 g/lb
D
CPU heat spreaders & heatsinks
Cu 85–99% on copper IHSBase Ni plating
D
EMI shield cans and fences
Cu 150–290 g/lb
D
LCD Panels (ITO / CCFL vs LED)
Base Indium ~0.4–0.8 g/m² of ITO layerAu 0.01–0.08 g per panel in COF tape bumpsCu ~17 g/lb
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Nixie Tubes, VFDs & Dekatrons
Base nickel cathodesBase tungsten filament (µg) in VFDsBase total metal value $0.02–0.15 per tube
D
Photomultiplier Tubes (PMTs)
Ag 0.1–2 g per tubeAu 0–20 mg per tubeBase BeCu dynodes with an activated BeO surface
D
Platinum RTD Probes (Pt100/Pt1000)
Pt ~30–80 mg per lb of complete probesBase 0.9–0.99 lb/lb 316SS or Inconel sheathPt SPRT: 15–30 g per unit
D
Power supplies
Au 0.005–0.03 g/lbCu 30–60 g per transformerAg in the relay
D
Thermal Printheads
Au 0.002–0.02 g per head ≈ 0.06 g/lbBase Ru as RuO2 glazeBase alumina substrate + Al heatsink bar
D
Thermistors (NTC/PTC) and piezo elements
Ag 2–5 g/lb
D
Transformers, inductors, chokes & toroids
Cu 100–220 g/lb
D