Copper in electronic waste
70 components in this guide contain copper. Spot price as of 4 Aug 2026: $4.85 per lb.
Richest sources by weight
| Component | Copper per lb | Value per lb | Tier |
|---|---|---|---|
| Beryllium copper contacts ☣ | 440 g | $4.70 | C |
| CPU heat spreaders & heatsinks | 400 g | $4.28 | D |
| Pogo Pins & Spring-Loaded Test Probes | 330 g | $3.53 | S |
| Insulated copper wire | 280 g | $2.99 | C |
| Machined-pin DIP sockets (gold barrel) | 250 g | $2.67 | B |
| Klystrons & Travelling-Wave Tubes | 250 g | $2.67 | C |
| CRT flyback transformers & deflection yokes ☠ | 250 g | $2.67 | D |
| Magnetron ☣☣ | 250 g | $2.67 | D |
| Silver-Plated Copper Wire & Coax | 230 g | $2.46 | B |
| Automotive wiring harness | 227 g | $2.43 | C |
| Hybrid / EV traction inverter ⚡ | 200 g | $2.14 | C |
| RF Coaxial Connectors (SMA/N/BNC/TNC) | 190 g | $2.03 | B |
These are yields per pound of that material, not per pound of whatever it came out of. That distinction is the single most common source of inflated figures online.
Everything containing copper
Pogo Pins & Spring-Loaded Test Probes
Au 1.4–3.0 g/lbCu ~330 g/lbBase steel springs
S
Silver-Graphite Brushes & Slip Rings
Ag 40–95% by weightCu pigtail + commutator segmentsBase electrographite
S
Aerospace Connectors & Backshells
Au 0.3–0.8 g/lb complete; ~3.6 g/lb de-populated contactsCu ~80 g/lbBase Backshells: ~0 g Au/lb
A
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Mil Circular Connectors (D38999/MS)
Au 0.20–0.50 g/lb whole; 2.5–4.0 g/lb de-pinned contactsCu ~80 g/lbBase 70–85% Al 6061-T6 shell
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Telecom backplanes
Au 1–3 g/lb wholeAg 0.5–2 g/lbCu 20–30%
A
Card sockets — PCMCIA, CF, SD, SIM
Au 0.8–2.5 g/lbCu ~150 g/lb
B
Hard drive PCBs
Au 0.3–0.8 g/lbAg 0.5–2 g/lbCu 15–25%
B
IBM Multi-Chip / Thermal Conduction Modules
Au 1–5 g per module ≈ 0.3–0.7 g/lbCu ~48 g/lbBase Mo internal wiring
B
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Machined-pin DIP sockets (gold barrel)
Au 1.0–2.4 g/lbCu ~250 g/lb
B
Plastic CPU with gold pins (P4, Athlon, S370/462/478)
Au 0.5–1.0 g/lbAg trace–0.3 g/lbCu IHS on P4
B
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Silver-Plated Copper Wire & Coax
Ag 2.8–6.8 g/lb as-received; 5.7–11.3 g/lb stripped conductorCu ~230 g/lbBase 40–55% PTFE/FEP
B
Wire-wrap / pin boards
Au 0.6–1.5 g/lbAg 0.5–2 g/lbCu 20–30%
B
ABS, transmission & body control modules
Au 0.010–0.030 g per moduleAg 0.2–1.5 g in BCM relay contactsCu 40–120 g in the ABS pump motorBase 1.5–3 lb aluminium hydraulic block
C
Arcade PCBs / JAMMA Boards
Au 0.05–0.20 g per board ≈ 0.09 g/lbCu ~45 g/lbAu ceramic gold-lid customs (FD1094
C
Automotive relays & fuse boxes
Ag 25–80 mg per mini ISO relayCu 1–3 g coil + terminals per relay
C
Automotive wiring harness
Cu 48–52% recovery stripped; ~35% as-pulledAu under 0.1 g per whole vehicle
C
Backup batteries & Dallas RTC modules ☠
Cu ~40 g/lbAu <0.1 g/lb
C
Beryllium copper contacts ☣
Au 0.5–1.5 g/lb when platedCu ~98%
C
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
Enterprise Switches, Line Cards & Optics
Au 0.15–0.6 g per large line card ≈ 0.075 g/lbCu ~70 g/lbBase chassis backplane
C
EV / hybrid battery management boards
Au 0.01–0.05 g per master boardAg ~0.1 g per master boardCu 10–50 g busbar traces per cell-tap board
C
Gold-fingered cards (untrimmed)
Au 0.2–0.5 g/lbAg 0.5–2 g/lbCu 15–25%
C
Graphics cards ⚠
Au 0.20–0.50 g/lbAg 0.5–2 g/lbCu 15–25%
C
HDD head arms & actuator assemblies
Au 0.1–0.3 g/lbNd NdFeB magnetsCu voice coil
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Industrial Control Boards (PLC/DCS/SCADA)
Au 0.05–0.20 g/lb typical I/O; 0.25–0.60 g/lb CPU and backplanes; 0.6–1.5 g/lb 1970s–80s ceramic-DIP DCSAg 1–8 g per relay moduleCu ~113 g/lb
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
Insulated copper wire
Cu 45–78% recovery by grade
C
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Modern lidded CPU (LGA775+, Core i, Ryzen)
Au 0.10–0.30 g/lbCu 15–25 g per chip
C
Peripheral & network cards
Au 0.20–0.50 g/lbAg 0.5–1.5 g/lbCu 15–25%
C
Silver mica capacitors
Ag 10–20 g/lbCu ~60 g/lb
C
Xenon HID ballasts & LED drivers
Au 0.003–0.015 g per ballastCu 30–90 g in the HV transformer and inductorsAg trace in thick-film and solder
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Carbon and metal film resistors
Cu ~15 g/lb
D
Ceramic HRC fuses (and glass fuses)
Ag 1–3 g/lbCu ~90 g/lb
D
Clip-on and bolt-on board heatsinks
Cu 0–450 g/lb
D
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
CPU heat spreaders & heatsinks
Cu 85–99% on copper IHSBase Ni plating
D
CRT flyback transformers & deflection yokes ☠
Cu 150–400 g per yokeBase ferrite core
D
EMI shield cans and fences
Cu 150–290 g/lb
D
Film capacitors (polyester / polypropylene)
Cu ~20 g/lb
D
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
LCD Panels (ITO / CCFL vs LED)
Base Indium ~0.4–0.8 g/m² of ITO layerAu 0.01–0.08 g per panel in COF tape bumpsCu ~17 g/lb
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Low-grade boards (PSU, TV, modem, appliance)
Au 0.005–0.05 g/lbAg 0.2–0.8 g/lbCu 8–15%
D
Magnetron ☣☣
Ag 0.5–2 g per magnetronCu 200–400 g per unitBase ferrite magnets
D
Optical Drives & Laser Pickups
Au 0.01–0.03 g per drive ≈ 0.011 g/lbCu ~16 g/lbBase Al 200–400 g
D
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Oxygen / lambda sensors
Pt 13 mg per sensor (≈0.05 g/lb)Cu 8–20 g in the leadBase steel body
D
Power supplies
Au 0.005–0.03 g/lbCu 30–60 g per transformerAg in the relay
D
Reed Switches & Reed Relays
Base Ru ~50–80 µg per switchBase Rh ~0.2–0.5 mg per switchCu ~40 g/lb
D
Ribbon cable & IDC connectors
Au 0.3–0.8 g/lb (heads only)Cu 15–25% in the cable
D
RJ45 Jacks with Integrated Magnetics
Au 0.02–0.07 g/lbCu ~57 g/lbBase ferrite
D
Set-top / cable boxes
Au 0.03–0.10 g/lbAg 0.3–1 g/lbCu 10–15%
D
Tactile switches and metal dome contacts
Au 0.05–0.4 g/lbAg 1–3 g/lbCu ~60 g/lb
D
Tape Drives & Libraries (LTO/DLT/DAT)
Au 0.05–0.20 g per LTO drive ≈ 0.03 g/lbCu ~10 g/lbBase 0.7–1.8 kg aluminium per full-height drive
D
Terminal blocks and screw terminals
Cu 110–200 g/lb
D
Transformers, inductors, chokes & toroids
Cu 100–220 g/lb
D
USB, HDMI, DisplayPort, RJ45 & audio jacks
Au 0.1–0.5 g/lbCu ~80 g/lb
D
Vintage Home Computers & Boards
Au 0.05–0.20 g per C64 board; 0.1–0.4 g per Apple II boardAu gold-lid ceramic DIPs at $150–400/lbCu ~40 g/lb
D