Palladium in electronic waste
17 components in this guide contain palladium. Spot price as of 4 Aug 2026: $1,284 per troy ounce ($41.3 per gram).
Richest sources by weight
| Component | Palladium per lb | Value per lb | Tier |
|---|---|---|---|
| MLCC — palladium-bearing (PME, pre-2000) | 4 g | $165 | S |
| MLCC — modern nickel (BME, post-2005) | 0.45 g | $18.6 | C |
| Thick-film resistor networks (SIP/DIP) | 0.4 g | $16.5 | C |
| Ceramic disc capacitors | 0.15 g | $6.19 | C |
| Cell phone boards | 0.05 g | $2.06 | A |
| Plastic ICs — pre-2010 (gold bond wire) | 0.05 g | $2.06 | B |
| Telecom / military boards | 0.04 g | $1.65 | A |
| Instrument clusters & head units | 0.04 g | $1.65 | C |
| Laptop motherboards | 0.035 g | $1.44 | B |
| Server motherboards | 0.035 g | $1.44 | B |
| Gold-fingered RAM | 0.03 g | $1.24 | A |
| Desktop motherboards | 0.02 g | $0.83 | C |
These are yields per pound of that material, not per pound of whatever it came out of. That distinction is the single most common source of inflated figures online.
Everything containing palladium
MLCC — palladium-bearing (PME, pre-2000)
Pd 2.3–9 g/lbAg 4.5–23 g/lbBase Ni
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
Cell phone boards
Au 0.09–0.50 g/lbAg 0.23–1.26 g/lbPd 0.025–0.07 g/lbCu 12–56%
A
Gold-fingered RAM
Au 0.3–0.6 g/lbAg 0.5–2 g/lbPd 0.01–0.05 g/lb
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Laptop motherboards
Au 0.20–0.50 g/lbAg 1–3 g/lbPd 0.02–0.08 g/lbCu 15–25%
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
Server motherboards
Au 0.05–0.3 g/lbAg 1–3 g/lbPd 0.02–0.10 g/lbCu 15–25%
B
Ceramic disc capacitors
Ag 4–10 g/lbPd 0.05–0.3 g/lb
C
Desktop motherboards
Au 0.02–0.15 g/lbAg 0.6–2 g/lbPd 0.01–0.05 g/lbCu 15–20%
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
Instrument clusters & head units
Au 0.008–0.100 g per unitAg 0.2–0.6 g in a premium head unitPd 0.02–0.06 g in a premium head unitCu 20–500 g
C
MLCC — modern nickel (BME, post-2005)
Pd 0.2–0.7 g/lbAg 1.4–2.7 g/lbBase Ni 5–20%
C
Thick-film resistor networks (SIP/DIP)
Ag 2–5 g/lbPd 0.2–0.7 g/lb
C
Trimmer Potentiometers (Cermet)
Au <0.15 g/lbBase Ru ~0.05–0.20 mg per unitPd <0.5 mg per unit
D