💨 Fumes, ventilation and open flame
serious
Where you meet it: Any hot work on circuit boards, conformal coating, epoxy, PVC or plastic housings
What you need to know
- Never burn circuit boards. FR-4 contains brominated flame retardants; uncontrolled combustion produces brominated dioxins and furans, hydrogen bromide, and heavy-metal-laden smoke. It is the single most harmful practice in informal e-waste processing — and it destroys value as well.
- Conformal coating, epoxy, PVC and plastic housings all release irritant and toxic products when heated. PVC gives hydrogen chloride and dioxins.
- A box fan pointed at you is not ventilation — it dilutes fume into your breathing zone. Use local exhaust capturing at the source, nozzle within a few inches, or work outdoors and upwind.
- For a bench: fume extractor with pre-filter, HEPA and activated carbon.
The rule: NEVER burn boards, wire insulation or plastic. Ever.
Components this applies to
MLCC — palladium-bearing (PME, pre-2000)
Pd 2.3–9 g/lbAg 4.5–23 g/lbBase Ni
S
Sterling & Silver-Plated Flatware
Ag 92.5% ≈ 420 g/lb sterlingAg hollow-handle knives: only 8–20 g per pieceAg silver plate: ~0.1–0.5 g per teaspoon
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
BGA with gold tab / gold-corner BGA
Au 1.0–2.0 g/lbAg 0.3–1 g/lb
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Card sockets — PCMCIA, CF, SD, SIM
Au 0.8–2.5 g/lbCu ~150 g/lb
B
Gold-plated SMD (SAW filters, RF modules, shields)
Au 0.5–1.5 g/lbAg 0.2–1 g/lb
B
Machined-pin DIP sockets (gold barrel)
Au 1.0–2.4 g/lbCu ~250 g/lb
B
Plastic ICs — pre-2010 (gold bond wire)
Au 0.5–0.7 g/lbAg 0.2–1 g/lbPd trace–0.1 g/lb
B
RF Coaxial Connectors (SMA/N/BNC/TNC)
Au 0.10–0.40 g/lb (SMA); 0.01–0.05 g/lb (N/BNC)Cu ~190 g/lbAg trace
B
Silver-Plated Copper Wire & Coax
Ag 2.8–6.8 g/lb as-received; 5.7–11.3 g/lb stripped conductorCu ~230 g/lbBase 40–55% PTFE/FEP
B
Tantalum capacitors
Ta 30–40 wt% of the capAg 1–3% in some
B
Automotive wiring harness
Cu 48–52% recovery stripped; ~35% as-pulledAu under 0.1 g per whole vehicle
C
Backup batteries & Dallas RTC modules ☠
Cu ~40 g/lbAu <0.1 g/lb
C
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
Ceramic disc capacitors
Ag 4–10 g/lbPd 0.05–0.3 g/lb
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
DIP, Rotary & BCD Switches
Au 0.20–0.40 g/lb (DIP); 0.10–0.25 g/lb (rotary)Ag 1.0–2.5 g/lbBase 60–75% plastic/phenolic
C
ECU / engine control module
Au 0.11 g/lb of bare boardAg 0.45 g/lbPd 0.05 g/lbCu ~20% of board mass
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Insulated copper wire
Cu 45–78% recovery by grade
C
Metal oxide varistors (MOVs)
Ag 6–14 g/lb
C
MLCC — modern nickel (BME, post-2005)
Pd 0.2–0.7 g/lbAg 1.4–2.7 g/lbBase Ni 5–20%
C
Silver mica capacitors
Ag 10–20 g/lbCu ~60 g/lb
C
Thick-film resistor networks (SIP/DIP)
Ag 2–5 g/lbPd 0.2–0.7 g/lb
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Carbon and metal film resistors
Cu ~15 g/lb
D
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
EMI shield cans and fences
Cu 150–290 g/lb
D
Film capacitors (polyester / polypropylene)
Cu ~20 g/lb
D
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
Optocouplers / optoisolators
Au 0.1–0.35 g/lbAg 2–5 g/lbCu ~120 g/lb
D
Terminal blocks and screw terminals
Cu 110–200 g/lb
D
Thermistors (NTC/PTC) and piezo elements
Ag 2–5 g/lb
D
Transformers, inductors, chokes & toroids
Cu 100–220 g/lb
D
USB, HDMI, DisplayPort, RJ45 & audio jacks
Au 0.1–0.5 g/lbCu ~80 g/lb
D