☣ Beryllium oxide (BeO)
fatal
Where you meet it: RF power transistor caps and substrates · microwave magnetron ceramic insulators · high-power resistors and terminations · laser diode submounts · klystrons, TWTs and transmitting tubes · some mil/aero hybrid substrates
What you need to know
- You cannot identify it by sight. BeO is often pink or salmon, but white and off-white BeO exists and ordinary alumina is also white. There is no field test.
- BeO is completely safe while intact and solid. The hazard is respirable particulate — dust and fume made by breaking it.
- Inhaled beryllium causes chronic beryllium disease: irreversible granulomatous lung scarring, which may first appear years after the exposure. It is also a confirmed human lung carcinogen. Sensitisation can follow a single significant exposure and there is no cure.
- OSHA's permissible limit is 0.2 µg/m³ over 8 hours — micrograms. It is among the lowest limits OSHA sets for anything.
- If a suspect part breaks: do not dry sweep and do not use a household vacuum. Wet-wipe or use a HEPA-filtered vacuum, bag the debris, dispose as hazardous waste.
The rule: NEVER grind, sand, file, saw, drill, abrasive-cut, sandblast, hammer, crush, shred, torch, melt or incinerate anything that might contain BeO. Sell or dispose of suspect parts intact. Broken beryllium parts are worth nothing; your lungs are worth everything.
Components this applies to
Gold flat packs (military / aerospace)
Au 3–10 g/lbAg 1–4 g/lb
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Thick-Film Hybrid Microcircuits
Au 1.5–4 g/lb packaged; 5–10 g/lb stripped substratesAg 0–15 g/lb on Ag/Pd conductor variantsPd present in Ag/Pd pastes
S
Ceramic CCD/CIS Image Sensors
Au 0.02–0.15 g per ceramic package ≈ 1.8 g/lbAu under 0.001 g per mobile/webcam moduleBase Nd-Fe-B in VCM actuators
A
Fiber transceivers (SFP/GBIC/QSFP) ⚠
Au 0.5–1.5 g/lb (whole modules)Ag trace
A
IC Test, Burn-In & ZIF Sockets
Au 0.5–2 g/lb complete; 3–8 g/lb de-populated contactsCu ~60 g/lbPd Pd-Ni with gold flash on high-cycle sockets
A
RF power transistors ☣
Au 0.5–2 g/lbBase Kovar
A
Telecom / military boards
Au 0.3–4 g/lbAg 1–8 g/lbPd 0.02–0.3 g/lbCu 15–25%
A
Gold-plated hermetic transistors (TO-3/TO-5/TO-18)
Au 0.5–2 g/lbBase Kovar
B
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Hybrid / EV traction inverter ⚡
Cu 3–8 kg per inverterAg 0.5–3 g sinter per power stageAu 0.02–0.08 g on gate-driver boardsBase 5–15 kg aluminium housing
C
Klystrons & Travelling-Wave Tubes
Cu ~250 g/lb (0.35–0.75 lb Cu per lb of tube)Au ~0.5–4 g per tubeAg 2–30 g per tube
C
Semiconductor Wafers & Fab Tooling
Au 0.0045 g/lb generic research-fab wafer scrapAu 7.4 g/lb for 1 µm gold-backed wafersBase quartz and SiC boats: zero metal
C
Vacuum tubes
Au 0.1–0.5 g/lb (gold-pin types)Ag traceBase nickel plates
C
Clip-on and bolt-on board heatsinks
Cu 0–450 g/lb
D
Magnetron ☣☣
Ag 0.5–2 g per magnetronCu 200–400 g per unitBase ferrite magnets
D
Photomultiplier Tubes (PMTs)
Ag 0.1–2 g per tubeAu 0–20 mg per tubeBase BeCu dynodes with an activated BeO surface
D
Thermal Printheads
Au 0.002–0.02 g per head ≈ 0.06 g/lbBase Ru as RuO2 glazeBase alumina substrate + Al heatsink bar
D
Vintage Home Computers & Boards
Au 0.05–0.20 g per C64 board; 0.1–0.4 g per Apple II boardAu gold-lid ceramic DIPs at $150–400/lbCu ~40 g/lb
D